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IXGH24N60C - HiPerFAST IGBT

Key Features

  • G = Gate, E = Emitter, Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Md Weight Mounting torque (M3) TO-247 TO-268 1.13/10 Nm/lb. in. 6 4 g g.
  • International standard packages JEDEC TO-247 and surface mountable TO-268.
  • High frequency IGBT.
  • High current handling capability.
  • Latest generation.

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Other Datasheets by IXYS (now Littelfuse)

Part Number Description
IXGH24N60CD1 HiPerFAST IGBT
IXGH24N60A HiPerFAST IGBT
IXGH24N60AU1 HiPerFAST IGBT
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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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HiPerFASTTM IGBT LightspeedTM Series IXGH 24N60C IXGT 24N60C VCES IC25 VCE(sat)typ tfi typ = 600 V = 48 A = 2.1 V = 60 ns Preliminary data www.DataSheet4U.com Symbol VCES VCGR VGES VGEM IC25 IC110 ICM SSOA (RBSOA) PC TJ TJM Tstg Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MW Continuous Transient TC = 25°C TC = 110°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 22 W Clamped inductive load, L = 100 mH TC = 25°C Maximum Ratings 600 600 ±20 ±30 48 24 96 ICM = 48 @ 0.8 VCES 150 -55 ... +150 150 -55 ... +150 300 V V V V A A A A TO-268 (IXGT) G E C (TAB) TO-247 AD (IXGH) C (TAB) G C E C = Collector, TAB = Collector W °C °C °C °C Features G = Gate, E = Emitter, Maximum lead temperature for soldering 1.6 mm (0.062 in.