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IXGH24N60A - HiPerFAST IGBT

Key Features

  • l Mounting torque (M3) 1.13/10 Nm/lb. in. 6 300 g °C l l l Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s l International standard package JEDEC TO-247 AD High frequency IGBT 2nd generation HDMOS TM process High current handling capability MOS Gate turn-on - drive simplicity.

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Other Datasheets by IXYS (now Littelfuse)

Part Number Description
IXGH24N60AU1 HiPerFAST IGBT
IXGH24N60AU1S HiPerFAST IGBT
IXGH24N60B HiPerFAST IGBT
IXGH24N60BU1 HiPerFAST IGBT
IXGH24N60C HiPerFAST IGBT

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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HiPerFASTTM IGBT IXGH 24N60A VCES IC25 VCE(sat) tfi = = = = 600 V 48 A 2.7 V 275 ns www.DataSheet4U.com Symbol Test Conditions TJ = 25 °C to 150°C TJ = 25 °C to 150°C; RGE = 1 MΩ Continuous Transient TC = 25 °C TC = 90 °C TC = 25 °C, 1 ms VGE = 15 V, T VJ = 125°C, RG = 22 Ω Clamped inductive load, L = 100 µH TC = 25 °C Maximum Ratings 600 600 ±20 ±30 48 24 96 ICM = 48 @ 0.8 VCES 150 -55 ... +150 150 -55 ... +150 V V V V A A A A W °C °C °C TO-247 AD VCES VCGR VGES VGEM I C25 I C90 I CM SSOA (RBSOA) PC TJ TJM Tstg Md Weight G C E C = Collector, TAB = Collector G = Gate, E = Emitter, Features l Mounting torque (M3) 1.13/10 Nm/lb.in. 6 300 g °C l l l Maximum lead temperature for soldering 1.6 mm (0.062 in.