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IXGH28N30 - HiPerFAST IGBT

Key Features

  • International standard packages JEDEC TO-268 surface and JEDEC TO-247 AD.
  • High current handling capability.
  • Newest generation.

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Full PDF Text Transcription for IXGH28N30 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for IXGH28N30. For precise diagrams, and layout, please refer to the original PDF.

HiPerFASTTM IGBT IXGH 28N30 IXGT 28N30 VCES IC25 VCE(sat)typ tfi(typ) = 300 V = 56 A = 1.6 V = 180 ns Preliminary data Symbol VCES VCGR VGES VGEM IC25 IC90 ICM SSOA (RBSO...

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s Preliminary data Symbol VCES VCGR VGES VGEM IC25 IC90 ICM SSOA (RBSOA) PC TJ TJM Tstg Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MW Continuous Transient TC = 25°C TC = 90°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 10 W Clamped inductive load, L = 100 mH TC = 25°C Maximum Ratings 300 300 ±20 ±30 56 28 112 ICM = 56 @ 0.8 VCES 150 -55 ... +150 150 -55 ... +150 300 260 V V V V A A A A TO-268 (IXGT) G E (TAB) TO-247 AD G C (TAB) C E C = Collector, TAB = Collector W °C °C °C °C °C G = Gate, E = Emitter, Maximum Lead temperature for soldering 1.6 mm (0.062 in.