IXYB82N120C3H1 Description
+150 °C Maximum Lead Temperature for Soldering 1.6 mm (0.062in.) from Case for 10s 300 °C 260 °C Mounting Force 30..120 / 6.7..27 N/lb.
IXYB82N120C3H1 Key Features
- Optimized for Low Switching Losses
- Square RBSOA
- Anti-Parallel Ultra Fast Diode
- High Current Handling Capability
- International Standard Package
- High Power Density
- Low Gate Drive Requirement