Datasheet4U Logo Datasheet4U.com

180N10 - Power MOSFETs

Key Features

  • Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation.
  • Low drain to tab capacitance(.

📥 Download Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
HiPerFETTM Power MOSFETs ISOPLUS247TM (Electrically Isolated Back Surface) Single MOSFET Die IXFR 180N10 VDSS = 100 V ID25 = 165 A RDS(on) = 8 mW trr £ 250 ns Preliminary data Symbol VDSS V DGR VGS V GSM I D25 ID(RMS) I DM IAR EAR EAS dv/dt PD TJ TJM Tstg TL VISOL Weight Symbol V DSS VGS(th) IGSS IDSS RDS(on) Test Conditions TJ = 25°C to 150°C T J = 25°C to 150°C; R GS = 1 MW Continuous Transient T C = 25°C (MOSFET chip capability) External lead (current limit) T C = 25°C, Note 1 TC = 25°C TC = 25°C TC = 25°C IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS TJ £ 150°C, RG = 2 W TC = 25°C 1.6 mm (0.063 in.) from case for 10 s 50/60 Hz, RMS t = 1 min Maximum Ratings 100 V 100 V ±20 V ±30 V 165 A 76 A 720 A 180 A 60 mJ 3 J 5 V/ns 400 W -55 ...