Overview: Advance Technical Information XPTTM 650V IGBT GenX3TM
Extreme Light Punch Through IGBT for 10-30kHz Switching IXYK200N65B3 IXYX200N65B3 VCES = IC110 = VCE(sat) tfi(typ) = 650V 200A
1.70V 157ns TO-264 (IXYK) Symbol
VCES VCGR VGES VGEM IC25 ILRMS IC110 ICM
IA EAS
SSOA
(RBSOA)
tsc (SCSOA)
PC TJ TJM Tstg TL TSOLD Md FC
Weight Test Conditions Maximum Ratings TJ = 25°C to 175°C TJ = 25°C to 175°C, RGE = 1M
Continuous
Transient 650 V 650 V
±20 V ±30 V TC = 25°C (Chip Capability) Terminal Current Limit TC = 110°C TC = 25°C, 1ms
TC = 25°C TC = 25°C
VGE = 15V, TVJ = 150°C, RG = 0 Clamped Inductive Load
VGE = 15V, VCE = 400V, TJ = 150°C RG = 10, Non Repetitive
TC = 25°C 410 160 200 1100
100 1
ICM = 200
@VCE VCES
8
1560 -55 ... +175
175 -55 ... +175 A A A A A J A
μs
W °C °C °C Maximum Lead Temperature for Soldering 1.6 mm (0.062in.) from Case for 10s Mounting Torque (TO-264) Mounting Force (PLUS247) 300 260 1.13/10 20..120 /4.5..27 °C °C Nm/lb.in N/lb TO-264 PLUS247 10 g 6g Symbol Test Conditions (TJ = 25C, Unless Otherwise Specified) BVCES IC = 250μA, VGE = 0V VGE(th) IC = 250μA, VCE = VGE ICES VCE = VCES, VGE = 0V TJ = 150°C IGES VCE = 0V, VGE = ±20V VCE(sat) IC = 100A, VGE = 15V, Note 1 TJ = 150°C Characteristic Values Min. Typ. Max. 650 V 3.5 6.0 V 25 μA 2 mA ±100 nA 1.40 1.56 1.
