IPB070N06NG Datasheet | Infineon

Features - Low gate charge for fast switching applications - N-channel enhancement - normal level - 175 °C operating temperature - Avalanche rated - Pb-free lead plating, Ro HS pliant Product Summary V DS R DS(on),max ID SMDversion 60 6.7 80 V mΩ A Type IPB070N06N G IPP070N06N G Type IPB066N06N G Package IPP066N06N G Marking Package P-TO263-3-2 P-TO263-3-2 070N06N P-TO220-3-1 Marking P-TO220-3-1 066N06N 070N06N 066N06N Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T C=25 °C1) T C=100 °C Pulsed drain current Avalanche energy, single pulse Reverse diode dv /dt Gate source voltage Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 1) 2) Value 80 80 320 530 6 ±20 Unit A I D,pulse E AS dv /dt V GS P tot T j, T stg T C=25 °C2) I D=80 A, R GS=25 Ω I D=80 A, V DS=48 V, di /dt =200 A/µs, T j,max=175 °C m J k V/µs V W °C T C=25 °C 250 -55 ... 175 55/175/56 Current is limited by bondwire; with an R th JC=0.6 K/W the chip is able to carry 127 A. See figure 3 Rev. 1.01 page 1 2006-06-19 .. IPB070N06N G Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - case SMD version, device on PCB R th JC R th JA minimal footprint 6 cm2 cooling area3) Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 m A V GS(th) I DSS V DS=V GS, I D=180 µA V DS=60 V, V GS=0 V, T j=25 °C V DS=60 V, V GS=0 V, T j=125 °C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=60 V V GS=10 V, I D=80 A, V GS=10 V, I D=80 A, SMD version Gate resistance Transconductance RG g fs |V DS|>2|I D|R DS(on)max, I D=80 A 60 2.1 3.0 0.01 - IPP070N06N G Unit max. Values typ. 0.6 62 40 K/W 4...