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SIGC42T120CS2
IGBT Chip in NPT-technology
FEATURES: • 1200V NPT technology 175µm chip • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling
This chip is used for: • IGBT Modules Applications: • drives, SMPS, resonant applications
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Chip Type SIGC42T120CS2
VCE 1200V
ICn 25A
Die Size 6.59 x 6.49 mm2
Package sawn on foil
Ordering Code Q67050A4338-A101
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 6.59 x 6.49 2 x (2.18 x 1.58) 1.06 x 0.65 42.8 / 33.