AUIRFU8405 Overview
Key Specifications
Package: TO-251-3
Mount Type: Surface Mount, Through Hole
Pins: 3
Height: 6.22 mm
Description
Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating.
Key Features
- Advanced Process Technology
- New Ultra Low On-Resistance
- 175°C Operating Temperature
- Fast Switching
- Repetitive Avalanche Allowed up to Tjmax
- Lead-Free, RoHS Compliant
- Automotive Qualified * VDSS RDS(on) typ. max. ID (Silicon Limited) ID (Package Limited) D D 40V 1.65m 1.98m 211A 100A
