F4-3L50R07W2H3F_B11 Overview
F4-3L50R07W2H3F_B11 EasyPACKModulmitschnellemTrench/FeldstoppHigh-Speed3IGBTundSiCDiodeundPressFIT/NTC EasyPACKmodulewithfastTrench/FieldstopHigh-Speed3IGBTandSiCdiodeandPressFIT/NTC TypischeAnwendungen 3-Level-Applikationen.
F4-3L50R07W2H3F_B11 Key Features
- CoolSiC(TM)Schottkydiodegen5
- HighspeedIGBTH3
- Lowswitchinglosses
- 3kVAC1mininsulation
- Al2O3substratewithlowthermalresistance
- pactdesign
- PressFITcontacttechnology
- Rugged mounting due to integrated mounting