Datasheet4U Logo Datasheet4U.com

GTVA220701FA - Thermally-Enhanced High Power RF GaN HEMT

Description

The GTVA220701FA is a 70-watt (P3dB) GaN high electron mobility transistor (HEMT) for use in multi-standard cellular power amplifier applications.

Features

  • input matching, high efficiency, and a thermally-enhanced package with earless flange. Features.
  • Input matched.
  • Typical Pulsed CW performance, 2170 MHz, 48 V - Output power at P3dB = 70 W - Efficiency = 70% - Gain = 20 dB.
  • Capable of handling 10:1 VSWR @48 V, 70 W (CW) output power.
  • GaN HEMT technology.
  • High power density.
  • High efficiency.
  • RoHS-compliant Advance Specification Data Sheets describe products that are being cons.

📥 Download Datasheet

Datasheet preview – GTVA220701FA

Datasheet Details

Part number GTVA220701FA
Manufacturer Infineon
File Size 119.48 KB
Description Thermally-Enhanced High Power RF GaN HEMT
Datasheet download datasheet GTVA220701FA Datasheet
Additional preview pages of the GTVA220701FA datasheet.

📁 Similar Datasheet

  • GTVA212701FA - Thermally-Enhanced High Power RF GaN on SiC HEMT (MACOM)
  • GTVA261701FA - Thermally-Enhanced High Power RF GaN on SiC HEMT (CREE)
  • GTVA261701FA - Thermally-Enhanced High Power RF GaN on SiC HEMT (Wolfspeed)
  • GTVA262701FA - Thermally-Enhanced High Power RF GaN on SiC HEMT (Wolfspeed)
  • GTVA263202FC - Thermally-Enhanced High Power RF GaN on SiC HEMT (Wolfspeed)
  • GTVA104001FA - High Power RF GaN (Wolfspeed)
  • GTVA107001EC - High Power RF GaN (Wolfspeed)
  • GTVA107001FC - High Power RF GaN (Wolfspeed)
  • GTVA123501FA - Thermally-Enhanced High Power RF GaN (Wolfspeed)
  • GTVA126001EC - 600W High Power RF GaN HEMT (MACOM)
Other Datasheets by Infineon

Full PDF Text Transcription

Click to expand full text
advance specification GTVA220701FA advance specification Thermally-Enhanced High Power RF GaN HEMT 70 W, 50 V, 1805 – 2170 MHz Description The GTVA220701FA is a 70-watt (P3dB) GaN high electron mobility transistor (HEMT) for use in multi-standard cellular power amplifier applications. It features input matching, high efficiency, and a thermally-enhanced package with earless flange.
Published: |