IDT71V2576S
IDT71V2576S is 128K X 36/ 256K X 18 3.3V Synchronous SRAMs 2.5V I/O/ Pipelined Outputs/ Burst Counter/ Single Cycle Deselect manufactured by Integrated Device Technology.
- Part of the IDT-71V comparator family.
- Part of the IDT-71V comparator family.
128K X 36, 256K X 18 3.3V Synchronous SRAMs 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect x x
IDT71V2576S IDT71V2578S IDT71V2576SA IDT71V2578SA
Features
128K x 36, 256K x 18 memory configurations Supports high system speed: mercial and Industrial:
- 150MHz 3.8ns clock access time
- 133MHz 4.2ns clock access time LBO input selects interleaved or linear burst mode Self-timed write cycle with global write control (GW), byte write enable (BWE), and byte writes (BWx) 3.3V core power supply Power down controlled by ZZ input 2.5V I/O Optional
- Boundary Scan JTAG Interface (IEEE 1149.1 pliant) Packaged in a JEDEC Standard 100-pin plastic thin quad flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball grid array (f BGA)
Description
The IDT71V2576/78 are high-speed SRAMs organized as 128K x 36/256K x 18. The IDT71V2576/78 SRAMs contain write, data, address and control registers. Internal logic allows the SRAM to generate a selftimed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as the IDT71V2576/78 can provide four cycles of data for a single address presented to the SRAM. An internal burst address counter accepts the first cycle address from the processor, initiating the access sequence. The first cycle of output data will be pipelined for one cycle before it is available on the next rising clock edge. If burst mode operation is selected (ADV=LOW), the subsequent three cycles of output data will be available to the user on the next three rising clock edges. The order of these three addresses are defined by the internal burst counter and the LBO input pin. The IDT71V2576/78 SRAMs utilize IDT’s latest high-performance CMOS process and are packaged in a JEDEC standard 14mm x 20mm 100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA) and 165 fine pitch ball grid array (f BGA).
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