28F160C3 Datasheet | Intel Corporation

Features - - - - - - - Flexible Smart Voltage Technology - 2.7 V- 3.6 V Read/Program/Erase - 12 V for Fast Production Programming 1.65 V- 2.5 V or 2.7 V- 3.6 V I/O Option - Reduces Overall System Power High Performance - 2.7 V- 3.6 V: 70 ns Max Access Time Optimized Architecture for Code Plus Data Storage - Eight 4 Kword Blocks, Top or Bottom Parameter Boot - Up to One Hundred-Twenty-Seven 32 Kword Blocks - Fast Program Suspend Capability - Fast Erase Suspend Capability Flexible Block Locking - Lock/Unlock Any Block - Full Protection on Power-Up - WP# Pin for Hardware Block Protection Low Power Consumption - 9 m A Typical Read - 7 A Typical Standby with Automatic Power Savings Feature (APS) Extended Temperature Operation - - 40 °C to +85 °C - - - - - - - 128-bit Protection Register - 64 bit Unique Device Identifier - 64 bit User Programmable OTP Cells Extended Cycling Capability - Minimum 100,000 Block Erase Cycles Software - Intel® Flash Data Integrator (FDI) - Supports Top or Bottom Boot Storage, Streaming Data (e.g., voice) - Intel Basic mand Set - mon Flash Interface (CFI) Standard Surface Mount Packaging - 48-Ball µBGA- /VFBGA - 64-Ball Easy BGA Packages - 48-Lead TSOP Package ETOX™ VIII (0.13 µm) Flash Technology - 16, 32 Mbit ETOX™ VII (0.18 µm) Flash Technology - 16, 32, 64 Mbit ETOX™ VI (0.25 µm) Flash Technology - 8, 16 and 32 Mbit The Intel® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest 0.13 µm and 0.18 µm technologies, represents a feature -rich solution for low-power applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase) with highspeed, low-power operation. Flexible block locking allows any block to be independently locked or unlocked. Add to this the Intel® Flash Data Integrator (FDI) software and you have a costeffective, flexible, monolithic code plus data storage solution. Intel® Advanced+ Boot Block Flash Memory (C3) products will be available in 48-lead TSOP, 48-ball...