IR0530CSP Description
International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon rather than through protruding leads enabling...
IR0530CSP Key Features
- Ultra Low VF To Footprint Area
- Very Low Profile (<0.6mm) Low Thermal Resistance Supplied Tested And On Tape & Reel
IR0530CSP Applications
- Reverse Polarity Protection