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IR0530CSPTRPBF Datasheet FlipKY

Manufacturer: International Rectifier (now Infineon)

General Description

International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.

The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space.

The anode and cathode connections are made through solder bump pads on one side of the silicon rather than through protruding leads enabling designers to strategically place the diodes on the PCB.

Overview

Bulletin I0175J rev.

C 05/06 www.DataSheet4U.com IR0530CSPTRPbF FlipKYTM 0.

Key Features

  • Ultra Low VF To Footprint Area.
  • Very Low Profile (.