Datasheet Details
| Part number | IRF6893MPbF |
|---|---|
| Manufacturer | International Rectifier (now Infineon) |
| File Size | 225.39 KB |
| Description | MOSFET |
| Datasheet | IRF6893MPbF-InternationalRectifier.pdf |
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Overview: PD - 97761 IRF6893MPbF IRF6893MTRPbF DirectFET®plus MOSFET with Schottky Diode l RoHs pliant Containing No Lead and Bromide Typical values (unless otherwise specified) l Integrated Monolithic Schottky Diode l Low Profile (<0.7 mm) l Dual Sided Cooling patible l Low Package Inductance l Optimized for High Frequency Switching VDSS VGS RDS(on) RDS(on) 25V max ±16V max 1.2m@ 10V 1.6m@ 4.5V Qg tot Qgd Qgs2 Qrr Qoss Vgs(th) 25nC 8.5nC 2.5nC 36nC 29nC 1.6V l Ideal for CPU Core DC-DC Converters l Optimized for Sync. FET socket of Sync. Buck Converter l Low Conduction and Switching Losses l patible with existing Surface Mount Techniques l 100% Rg tested l Footprint patible to DirectFET™ MX ISOMETRIC Applicable DirectFET Outline and Substrate Outline (see p.
| Part number | IRF6893MPbF |
|---|---|
| Manufacturer | International Rectifier (now Infineon) |
| File Size | 225.39 KB |
| Description | MOSFET |
| Datasheet | IRF6893MPbF-InternationalRectifier.pdf |
|
|
|
The IRF6893MPbF bines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and less than 0.7 mm profile.
The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques.
Application note AN-1035 is followed regarding the manufacturing methods and processes.
| Part Number | Description |
|---|---|
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