IRF6894MTRPBF Overview
The IRF6894MPbF bines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET TM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and less than 0.7 mm profile. The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques....
IRF6894MTRPBF Key Features
- Dual Sided Cooling patible Qg tot Qgd Qgs2 Qrr Qoss Vgs(th)
- Low Package Inductance 26nC 9.8nC 2.8nC 56nC 31nC 1.6V
- Optimized for High Frequency Switching
- Ideal for CPU Core DC-DC Converters
- Optimized for Sync. FET socket of Sync. Buck Converter
- Low Conduction and Switching Losses
- patible with existing Surface Mount Techniques
- 100% Rg tested ISOMETRIC MX
