IRFHM8334TRPBF Datasheet | International Rectifier

Features Low Thermal Resistance to PCB (< 4.5°C/W) Low Profile (<1.2mm) Industry-Standard Pinout patible with Existing Surface Mount Techniques Ro HS pliant, Halogen-Free MSL1, Consumer Qualification IRFHM8334TRPb F HEXFET® Power MOSFET PQFN 3.3 X 3.3 mm Benefits Enable better thermal dissipation Increased Power Density results in Multi-Vendor patibility ⇒ Easier Manufacturing Environmentally Friendlier Increased Reliability Base Part Number IRFHM8334PBF Package Type PQFN 3.3mm x 3.3mm Standard Pack Form Quantity Tape and Reel Orderable Part Number IRFHM8334TRPBF Absolute Maximum Ratings Parameter VGS ID @ TA = 25°C ID @ TC(Bottom) = 25°C ID @ TC(Bottom) = 100°C ID @ TC = 25°C Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V (Source Bonding Technology Limited) IDM PD @TA = 25°C PD @TC(Bottom) = 25°C Pulsed Drain Current f Power Dissipation Power Dissipation TJ TSTG Linear Derating Factor Operating Junction and Storage Temperature Range Max. ± 20 13 43gh 27gh 25h 176 2.7 28 0.021 -55 to + 150 Units W W/°C °C Notes  through † are on page 9 1 .irf. © 2014 International Rectifier Submit Datasheet...