IRFP460P
Description
Third Generation HEXFET®s from International Rectifier provide the designer with the best bination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-247 package is preferred for mercial-industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because of its isolated mounting hole. It also provides greater creepage distance between pins to meet the requirements of most safety specifications. The solder plated version of the TO-247 allows the reflow soldering of the package heatsink to a substrate material.
ID = 20A
TO-247AC
Max.
20 13 80 280 2.2 ± 20 960 20 28 3.5 -55 to + 150 300 (1.6mm from case ) 10 lbf- in (1.1N- m) 230 (Time above 183 °C should not exceed 100s)
Absolute Maximum Ratings
Parameter
ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VGS EAS IAR EAR dv/dt TJ TSTG Continuous Drain Current, VGS @ 10V Continuous Drain...
