AUIRF1324S Overview
Key Specifications
Package: D2PAK
Mount Type: Surface Mount
Pins: 3
Height: 4.83 mm
Description
Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating.
Key Features
- ID (Silicon Limited) ID (Package Limited) G S 24V 1.3mΩ 340A 195A c
