IRF6100 Description
True chip-scale packaging is available from International Rectifier. Through the use of advanced processing techniques, and a unique packaging concept, extremely low on-resistance and the highest power densities in the industry have been made available for battery and load management applications. These benefits, bined with the ruggedized device design , that International Rectifier is well known for, provides the...
IRF6100 Key Features
- Low Thermal Resistance
- P-Channel MOSFET
- One-third Footprint of SOT-23
- Super Low Profile (<.8mm)