• Part: US3BBF
  • Manufacturer: JGD
  • Size: 142.97 KB
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US3BBF Key Features

  • For surface mounted application
  • Low Profile Package
  • Glass Passivated Chip Junction
  • High Temp Soldering: 260℃ for 10seconds at Terminals
  • Superfast Recovery Times
  • Case: SMBF Molded plastic
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Polarity: Indicated by cathode band

Other US3BBF Datasheets

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DC COMPONENTS Logo DC COMPONENTS US3BBF SURFACE MOUNT ULTRA FAST RECTIFIER
Jingdao Microelectronics
Jingdao Microelectronics		 US3BBF Surface Mount Ultrafast Recovery Rectifier
MIC Logo MIC US3BBF SURFACE MOUNT ULTRA FAST RECOVERY RECTIFIER
FEC Semiconductor
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Jingdao Microelectronics
Jingdao Microelectronics		 US3BB Surface Mount Ultrafast Recovery Rectifier

View all US3BBF datasheets →

US3BBF Description

US3ABF THRU US3MBF 3.0 Amp. Surface Mount Glass Passivated High Efficient Rectifiers.