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US3ABF THRU US3MBF
3.0 Amp. Surface Mount Glass Passivated High Efficient Rectifiers
Features
* For surface mounted application * Low Profile Package * Glass Passivated Chip Junction * High Temp Soldering: 260℃ for 10seconds at Terminals * Superfast Recovery Times
A C
B DE
G F
DIM.
A B C D E F G
SMBF
INCHES
MIN MAX
0.201
0.217
0.138
0.146
0.165
0.173
0.075
0.087
0.043
0.051
0.007
0.010
0.031
0.047
MM MIN MAX 5.10 5.50 3.5 3.7 4.2 4.4 1.90 2.20 1.10 1.30 0.18 0.26 0.80 1.