US3GBF
Key Features
- For surface mounted application
- Low Profile Package
- Glass Passivated Chip Junction
- High Temp Soldering: 260℃ for 10seconds at Terminals
- Superfast Recovery Times
- Case: SMBF Molded plastic
- Terminals: Solderable per MIL-STD-750, Method 2026
- Polarity: Indicated by cathode band
