SC7777D - hybrid IC

Product Overview

KOA Speer Electronics

Part number	SC7777D
Manufacturer	KOA Speer Electronics
File Size	92.05 KB
Description	hybrid IC
Datasheet	SC7777D Datasheet
Additional preview pages of the SC7777D datasheet.

Adjustment processes are decreased by function and ratio trimmings.
High density mounting by bonding (COB).
Various types of package are available.
High reliability achieved by KOA’s original thick film technology.
Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production EW ordering information.

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Published: Jul 5, 2009 |