SC7777D - hybrid IC

KOA Speer Electronics

Key Features

Adjustment processes are decreased by function and ratio trimmings.
High density mounting by bonding (COB).
Various types of package are available.
High reliability achieved by KOA’s original thick film technology.
Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production EW ordering information.

SC7777D hybrid ic by KOA Speer Electronics - Datasheet Preview

Datasheet Details

Part number	SC7777D
Manufacturer	KOA Speer Electronics
File Size	92.05 KB
Description	hybrid IC
Datasheet	SC7777D Datasheet

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KA, SC www.DataSheet4U.com hybrid IC EU NEW features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding (COB) • Various types of package are available • High reliability achieved by KOA’s original thick film technology • Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production EW ordering information N New Part # KA Product Code KA: Hybrid IC SC: Non-Noble 7777 KOA Ref.