SC7777D Description
KA, SC .. hybrid IC EU.
SC7777D Key Features
- Adjustment processes are decreased by function and ratio trimmings
- High density mounting by bonding (COB)
- Various types of package are available
- High reliability achieved by KOA’s original thick film technology
- Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receiv
- KA/CB Series
- 199 Bolivar Drive
- Bradford, PA 16701
- 814-362-5536
- Fax: 814-362-8883