Datasheet Summary
KA, SC
.. hybrid IC
NEW Features
- Adjustment processes are decreased by function and ratio trimmings
- High density mounting by bonding (COB)
- Various types of package are available
- High reliability achieved by KOA’s original thick film technology
- Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production
EW ordering information N
New Part # KA Product Code KA: Hybrid IC SC: Non-Noble 7777 KOA Ref. Number D Terminal Surface Material D: SnAgCu T: Sn ponent
- KA/CB Series
Substrate Materials Item AI2O3...