C08051Cxxxx Overview
.. CERAMIC CHIP CAPACITORS ELECTRODES L B TIN PLATE NICKEL PLATE CONDUCTIVE METALLIZATION DIMENSIONS—MILLIMETERS AND (INCHES) EIA EIA SIZE SIZE CODE Solder Reflow Solder Reflow * Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.) + For extended value 1210 case size - solder reflow only. CAPACITOR ORDERING INFORMATION (Standard Chips - For C 0805 C 103 K 5 R A C*
C08051Cxxxx Key Features
- C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
- 10, 16, 25, 50, 100 and 200 Volts
- Standard End Metalization: Tin-plate over nickel barrier
- RoHS pliant
- Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette,
- solder reflow only
- ±0.10pF J
- ±0.25pF K
- ±10% D
- ±0.5pF M