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KXTJ2-1009 - Tri-axis Digital Accelerometer

Download the KXTJ2-1009 datasheet PDF. This datasheet also covers the KXTJ2 variant, as both devices belong to the same tri-axis digital accelerometer family and are provided as variant models within a single manufacturer datasheet.

General Description

The KXTJ2 is a tri-axis +/-2g, +/-4g or +/-8g silicon micromachined accelerometer.

The sense element is fabricated using Kionix’s proprietary plasma micromachining process technology.

Key Features

  • n 1 +X +Y +Z When device is accelerated in +X, +Y or +Z direction, the corresponding output will increase. Static X/Y/Z Output Response versus Orientation to Earth’s su.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (KXTJ2-Kionix.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number KXTJ2-1009
Manufacturer Kionix
File Size 807.40 KB
Description Tri-axis Digital Accelerometer
Datasheet download datasheet KXTJ2-1009 Datasheet

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Other Datasheets by Kionix

Part Number Description
KXTJ3-1057 Tri-axis Digital Accelerometer
KXTJ9-1005 Tri-axis Digital Accelerometer
KXTC9-2050 Tri-axis Analog Accelerometer
KXTF9-1026 Tri-axis Digital Accelerometer
KXTIA-1006 Tri-axis Digital Accelerometer

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
PART NUMBER: ± 2g / 4g / 8g Tri-axis Digital Accelerometer Specifications KXTJ2-1009 Rev. 4 Mar-2013 Product Description The KXTJ2 is a tri-axis +/-2g, +/-4g or +/-8g silicon micromachined accelerometer. The sense element is fabricated using Kionix’s proprietary plasma micromachining process technology. Acceleration sensing is based on the principle of a differential capacitance arising from acceleration-induced motion of the sense element, which further utilizes common mode cancellation to decrease errors from process variation, temperature, and environmental stress. The sense element is hermetically sealed at the wafer level by bonding a second silicon lid wafer to the device using a glass frit.