MT47H1G4 Description
, package dimensions, and the ballout only. Refer to Micron's 2Gb DDR2 data sheet for plete information or for specifications not included in this document. Marking 1G4 512M8 WTR -25E -25 -3 -37E None None :C Table.
MT47H1G4 Key Features
- 64 Meg x 4 x 8 Banks x 2 Ranks MT47H512M8
- 32 Meg x 8 x 8 Banks x 2 Ranks Features
- Uses 2Gb Micron die
- Two ranks (includes dual CS#, ODT, and CKE balls)
- Each rank has 8 internal banks for concurrent operation
- VDD = V DDQ = +1.8V ±0.1V
- JEDEC-standard 63-ball FBGA
- Low-profile package
- 1.35mm MAX thickness Functionality The 4Gb (TwinDie™) DDR2 SDRAM uses Micron’s 2Gb DDR2 monolithic die and has similar f
- Configuration