• Part: MHVIC915R2
  • Description: 746-960 MHz RF LDMOS Wideband Integrated Power Amplifier
  • Manufacturer: Motorola Semiconductor
  • Size: 652.38 KB
Download MHVIC915R2 Datasheet PDF
Motorola Semiconductor
MHVIC915R2
MHVIC915R2 is 746-960 MHz RF LDMOS Wideband Integrated Power Amplifier manufactured by Motorola Semiconductor.
MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR TECHNICAL DATA Order this document by MHVIC915R2/D The RF Line 746-960 MHz RF LDMOS Wideband Integrated Power Amplifier The MHVIC915R2 wideband integrated circuit is designed for CDMA and GSM/GSM EDGE applications. It uses Motorola’s newest high voltage (26 to 28 Volts) LDMOS IC technology and integrates a multi- stage structure. Its wideband On- Chip integral matching circuitry makes it usable from 746 to 960 MHz. The linearity performances cover all modulations for cellular applications: GSM, GSM EDGE, TDMA, and CDMA. The device is packaged in a PFP- 16 flat pack package that provides excellent thermal performance through a solderable backside contact. - Typical CDMA Performance: 869- 894 MHz, 27 Volts, IDQ1 = 80 m A, IDQ2 = 120 m A, 1- Carrier N- CDMA, IS- 95 CDMA 9- Channel Forward Driver Application Output Power - 23 d Bm Power Gain - 31 d B Adjacent Channel Power Ratio - - 60 d Bc @ 750 k Hz in a 30 k Hz BW - 66 d Bc @ 1.98 MHz in a 30 k Hz BW Output Application Output Power - 34 d Bm PAE = 21% Adjacent Channel Power Ratio - - 50 d Bc @ 750 k Hz in a 30 k Hz BW - Typical GSM Performance: 921- 960 MHz, 26 Volts Output Power - 15 W P1d B Power Gain - 30 d B @ P1d B Drain Efficiency = 56% @ P1d B - On- Chip Matching (50 Ohm Input, >9 Ohm Output) - On- Chip Current Mirror gm Sensing FET for Self Bias Application - Integrated Temperature pensation Capability - Usable for SCPA and MCPA Architecture - Integrated ESD Protection - Available in Tape and Reel. R2 Suffix = 1,500 Units per 16 mm, 13 inch Reel. CDMA, GSM/GSM EDGE 746- 960 MHz, 15 W, 27 V RF LDMOS WIDEBAND INTEGRATED AMPLIFIER Freescale Semiconductor, Inc... CASE 978- 03 PFP- 16 PLASTIC VBSD VBSG VD1 N.C. 2 Stage IC VD2/RFout VBSD VBSG RFin IC VD1 Gnd VG1 VG2 RFin Temperature pensation VG1 VG2 PIN CONNECTIONS 1 2 3 4 5 6 7 8 (Top View) 16 15 14 13 12 11 10 9 N.C. VD2/RFout VD2/RFout VD2/RFout VD2/RFout VD2/RFout VD2/RFout N.C. REV 3 MOTOROLA RF DEVICE DATA ...