UPA800TF
FEATURES
- -
- SMALL PACKAGE STYLE: SOT-363 package measures just 2.0 mm x 1.25 mm LOW HEIGHT PROFILE: Just 0.60 mm high EXCELLENT LOW VOLTAGE, LOW CURRENT PERFORMANCE
0.65 2.0 ± 0.2 1.3 2 1
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE TS06 (Top View)
2.1 ± 0.1 1.25 ± 0.1
6 0.22
- 0.05 (All Leads) 5
+0.10
DESCRIPTION
The UPA800TF contains two NE680 NPN high frequency silicon bipolar chips. NEC's new low profile TF package is ideal for all portable wireless applicatons where reducing ponent height is a prime consideration. Each transistor chip is independently mounted and easily configured for two stage cascade LNAs and other similar applications.
0.6 ± 0.1 0.45 0.13 ±0.05 0 ~ 0.1
ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C)
SYMBOLS VCBO VCEO VEBO IC PT PARAMETERS Collector to Base Voltage Collector to Emitter Voltage Emitter to Base Voltage Collector Current Total Power Dissipation 1 Die 2 Die Junction Temperature Storage Temperature UNITS V V V m A m W m W °C °C...
