NSP1830 Datasheet | NOVOSENSE

Overview Novosense NSP1830 series MEMS pressure sensors are high-performance and high-reliability MEMS differential pressure sensor dies, based on the principle of monocrystalline silicon high sensitivity piezoresistive effect, and manufactured by the advanced MEMS technology. The NSP1830 series MEMS differential pressure sensors are qualified according to AEC-Q103 and guaranteed the accuracy and stability better than 1% FS in overall lifetime, the typical pressure ranges are 0~±100k Pa and 0~500k Pa, widely used in consumer electronics, medical electronics, industrial controls, automotive electronics etc. The bonded glass substate is optional to improve stability. The wafer manufactured platform of NSP1830 series MEMS differential pressure sensors is verified to fulfill the International Automotive Standard IATF16949:2016. Each wafer is inspected both in backside and frontside by 100% AOI and the electronic AOI wafer map is provided for each wafer. For additional shipping options, please contact Novosense sales. Key Features - Pressure range: 0~±100k Pa, 500k Pa - Operating temperature：-40~125℃ - Die size：1.8mmx1.8mmx0.4mm - Accuracy and stability better than 1%FS - Optional bonded glass substate - IATF16949 certificated manufactured platform - AEC-Q103 automotive standards qualified - ROHS & REACH pliant Applications - White Household - Consumer - Medical - Industrial Controls Device Information Part Number NSP1830-Bxx100 NSP1830-Gxx500 Span 0~±100k Pa 0~500k Pa Die Size 1.8mmx1.8mmx0.4mm 1.8mmx1.8mmx0.9mm Copyright © 2022, NOVOSENSE Page 1 NSP1830 Series Datasheet (EN) 1.0 INDEX 1. DIMENSIONS AND DIAGRAM 3 2. ABSOLUTE MAXIMUM RATINGS 4 3. CHARACTERISTIC...