BY558 Overview
Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. k a MAM384 Fig.1 Simplified outline (SOD115) and symbol.
BY558 Key Features
- Glass passivated
- High maximum operating temperature
- Low leakage current
- Excellent stability
- Also available with preformed leads for easy insertion
- Designed to withstand transients up to 1700 V
BY558 Applications
- For use in multi-sync monitor horizontal deflection circuits