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BY558 - Damper diodes

Datasheet Summary

Description

Rugged glass package, using a high temperature alloyed construction.

This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.

Fig.1 Simplified outline (SOD115) and symbol.

Features

  • Glass passivated.
  • High maximum operating temperature.
  • Low leakage current.
  • Excellent stability.
  • Also available with preformed leads for easy insertion.
  • Designed to withstand transients up to 1700 V.

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Datasheet Details

Part number BY558
Manufacturer NXP
File Size 66.23 KB
Description Damper diodes
Datasheet download datasheet BY558 Datasheet
Additional preview pages of the BY558 datasheet.

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Full PDF Text Transcription

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DISCRETE SEMICONDUCTORS DATA SHEET handbook, 2 columns M3D333 BY558; BY578 Damper diodes Product specification File under Discrete Semiconductors, SC01 1998 Jun 25 Philips Semiconductors Product specification Damper diodes FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Also available with preformed leads for easy insertion • Designed to withstand transients up to 1700 V. APPLICATIONS • For use in multi-sync monitor horizontal deflection circuits handbook, halfpage BY558; BY578 DESCRIPTION Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. k a MAM384 Fig.
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