NXP Semiconductors BYD31
This package is hermetically sealed MAM196 Fig.1 Simplified outline (SOD91) and symbol.| Part No. | BYD31 |
|---|---|
| Datasheet | BYD31 Download |
| Manufacturer |  NXP Semiconductors |
| Description | Fast soft-recovery controlled avalanche rectifiers |
| Buy | Stock & Price |
FEATURES
● Glass passivated● High maximum operating temperature
● Low leakage current
● Excellent stability
● Guaranteed avalanche energy absorption capability
● Available in ammo-pack. k a BYD31 series and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips.
DESCRIPTION
Cavity free cylindrical glass package through Implotec™(1) technology. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM BYD31D BYD31G BYD31J BYD31K BYD31M VR continuous reverse voltage BYD31D BYD31G BYD31J BYD31K BYD31M IF(AV) average forward current Ttp = 55 °C; lead length = 10 mm; see Fig.2; averaged over any 20 ms period; see also Fig.6 Tamb = 60 °C; PCB mounting (see Fig.11); see Fig.3; averaged over any 20 ms period; see also Fig.6 IFRM IFSM repetitive peak forward current non-repetitive peak forward current Ttp = 55 °C; see Fig.4 Tamb = 60 °C; see Fig.5 t = 10 ms half sine wave; Tj = Tj max prior to surge; VR...
