BYD31G - Fast soft-recovery controlled avalanche rectifiers
NXP Semiconductors
General Description
Cavity free cylindrical glass package through Implotec™(1) technology.
Fig.1 Simplified outline (SOD91) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).
Key Features
Glass passivated.
High maximum operating temperature.
Low leakage current.
Excellent stability.
Guaranteed avalanche energy absorption capability.
Available in ammo-pack. k a
BYD31 series
and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips.
Full PDF Text Transcription for BYD31G (Reference)
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BYD31G. For precise diagrams, and layout, please refer to the original PDF.
DISCRETE SEMICONDUCTORS DATA SHEET andbook, halfpage M3D122 BYD31 series Fast soft-recovery controlled avalanche rectifiers Product specification Supersedes data of 1996 J...
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ed avalanche rectifiers Product specification Supersedes data of 1996 Jun 05 1996 Sep 18 Philips Semiconductors Product specification Fast soft-recovery controlled avalanche rectifiers FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • Available in ammo-pack. k a BYD31 series and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips. DESCRIPTION Cavity free cylindrical glass package through Implotec™(1) technology. This package is hermetically sealed MAM196 F
BYD31G Datasheet
