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BYG50K - Controlled avalanche rectifiers

Datasheet Summary

Description

DO-214AC; SOD106 surface mountable package with glass passivated chip.

Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.

LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).

Features

  • Glass passivated.
  • High maximum operating temperature.
  • Low leakage current.
  • Excellent stability.
  • Guaranteed avalanche energy absorption capability.
  • UL 94V-O classified plastic package.
  • Shipped in 12 mm embossed tape. Top view Side view handbook, 4 columns BYG50 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic.

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Datasheet Details

Part number BYG50K
Manufacturer NXP
File Size 41.11 KB
Description Controlled avalanche rectifiers
Datasheet download datasheet BYG50K Datasheet
Additional preview pages of the BYG50K datasheet.

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Full PDF Text Transcription

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DISCRETE SEMICONDUCTORS DATA SHEET ok, halfpage M3D168 BYG50 series Controlled avalanche rectifiers Preliminary specification 1996 May 24 Philips Semiconductors Preliminary specification Controlled avalanche rectifiers FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • UL 94V-O classified plastic package • Shipped in 12 mm embossed tape. Top view Side view handbook, 4 columns BYG50 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic. DESCRIPTION DO-214AC; SOD106 surface mountable package with glass passivated chip. cathode band k a MSA474 Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
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