Datasheet4U Logo Datasheet4U.com
NXP Semiconductors logo

BYG50M

Manufacturer: NXP Semiconductors

BYG50M datasheet by NXP Semiconductors.

BYG50M datasheet preview

BYG50M Datasheet Details

Part number BYG50M
Datasheet BYG50M_PhilipsSemiconductors.pdf
File Size 41.11 KB
Manufacturer NXP Semiconductors
Description Controlled avalanche rectifiers
BYG50M page 2 BYG50M page 3

BYG50M Overview

SOD106 surface mountable package with glass passivated chip. cathode band k a MSA474 Fig.1 Simplified outline (DO-214AC; LIMITING VALUES In accordance with the Rating System (IEC 134).

BYG50M Key Features

  • Glass passivated
  • High maximum operating temperature
  • Low leakage current
  • Excellent stability
  • Guaranteed avalanche energy absorption capability
  • UL 94V-O classified plastic package
  • Shipped in 12 mm embossed tape
NXP Semiconductors logo - Manufacturer

More Datasheets from NXP Semiconductors

View all NXP Semiconductors datasheets

Part Number Description
BYG50 Controlled avalanche rectifiers
BYG50D Controlled avalanche rectifiers
BYG50G Controlled avalanche rectifiers
BYG50J Controlled avalanche rectifiers
BYG50K Controlled avalanche rectifiers
BYG26 SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26D SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26G SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26J SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG60 Fast soft-recovery controlled avalanche rectifiers

BYG50M Distributor

Datasheet4U Logo
Since 2006. D4U Semicon. About Datasheet4U Contact Us Privacy Policy Purchase of parts