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BYG60 Datasheet Fast Soft-recovery Controlled Avalanche Rectifiers

Manufacturer: NXP Semiconductors

Overview: DISCRETE SEMICONDUCTORS DATA SHEET ok, halfpage M3D168 BYG60 series Fast soft-recovery controlled avalanche rectifiers Preliminary specification File under Discrete Semiconductors, SC01 1996 Jun 05 Philips Semiconductors.

General Description

DO-214AC surface mountable package with glass passivated chip.

cathode band a k Side view MSA474 Fig.1 Simplified outline (DO-214AC;

SOD106) and symbol.

Key Features

  • Glass passivated.
  • High maximum operating temperature.
  • Low leakage current.
  • Excellent stability.
  • Guaranteed avalanche energy absorption capability.
  • UL 94V-O classified plastic package.
  • Shipped in 12 mm embossed tape. Top view handbook, 4 columns BYG60 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic.

More Datasheets from NXP Semiconductors

Part Number Description
BYG60D Fast soft-recovery controlled avalanche rectifiers
BYG60G Fast soft-recovery controlled avalanche rectifiers
BYG60J Fast soft-recovery controlled avalanche rectifiers
BYG60K Fast soft-recovery controlled avalanche rectifiers
BYG60M Fast soft-recovery controlled avalanche rectifiers
BYG26 SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26D SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26G SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26J SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG50 Controlled avalanche rectifiers

BYG60 Distributor