Datasheet4U Logo Datasheet4U.com
NXP Semiconductors logo

BYG60K

Manufacturer: NXP Semiconductors

BYG60K datasheet by NXP Semiconductors.

BYG60K datasheet preview

BYG60K Datasheet Details

Part number BYG60K
Datasheet BYG60K_PhilipsSemiconductors.pdf
File Size 64.12 KB
Manufacturer NXP Semiconductors
Description Fast soft-recovery controlled avalanche rectifiers
BYG60K page 2 BYG60K page 3

BYG60K Overview

DO-214AC surface mountable package with glass passivated chip. cathode band a k Side view MSA474 Fig.1 Simplified outline (DO-214AC; LIMITING VALUES In accordance with the Rating System (IEC 134).

BYG60K Key Features

  • Glass passivated
  • High maximum operating temperature
  • Low leakage current
  • Excellent stability
  • Guaranteed avalanche energy absorption capability
  • UL 94V-O classified plastic package
  • Shipped in 12 mm embossed tape
NXP Semiconductors logo - Manufacturer

More Datasheets from NXP Semiconductors

View all NXP Semiconductors datasheets

Part Number Description
BYG60 Fast soft-recovery controlled avalanche rectifiers
BYG60D Fast soft-recovery controlled avalanche rectifiers
BYG60G Fast soft-recovery controlled avalanche rectifiers
BYG60J Fast soft-recovery controlled avalanche rectifiers
BYG60M Fast soft-recovery controlled avalanche rectifiers
BYG26 SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26D SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26G SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26J SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG50 Controlled avalanche rectifiers

BYG60K Distributor

Datasheet4U Logo
Since 2006. D4U Semicon. About Datasheet4U Contact Us Privacy Policy Purchase of parts