BYG60J Description
DO-214AC surface mountable package with glass passivated chip. cathode band a k Side view MSA474 Fig.1 Simplified outline (DO-214AC; LIMITING VALUES In accordance with the Rating System (IEC 134).
BYG60J Key Features
- Glass passivated
- High maximum operating temperature
- Low leakage current
- Excellent stability
- Guaranteed avalanche energy absorption capability
- UL 94V-O classified plastic package
- Shipped in 12 mm embossed tape