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BYX10G - Rectifier

General Description

temperature alloyed construction.

matched.

Fig.1 Simplified outline (SOD57) and symbol.

Key Features

  • Glass passivated.
  • High maximum operating temperature.
  • Low leakage current.
  • Excellent stability.
  • Available in ammo-pack.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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DISCRETE SEMICONDUCTORS DATA SHEET handbook, 2 columns M3D116 BYX10G Rectifier Product specification 1996 May 24 Philips Semiconductors Rectifier Product specification BYX10G FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Available in ammo-pack. DESCRIPTION This package is hermetically sealed and fatigue free as coefficients of Rugged glass package, using a high expansion of all used parts are temperature alloyed construction. matched. 2/3 pagek(Datasheet) a MAM047 Fig.1 Simplified outline (SOD57) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).