BYX10GP Overview
Key Specifications
Mount Type: Through Hole
Pins: 2
Height: 2.71 mm
Length: 5.2 mm
Key Features
- Superectifier structure for high reliability application
- Cavity-free glass-passivated junction
- 0.36 A operation at TA = 40 °C with no thermal runaway
- Typical IR less than 0.1 μA
- Solder dip 275 °C max. 10 s, per JESD 22-B106