NXP Semiconductors P3T1755
The P3T1755 is a temperature-to-digital converter from -40 °C to +125 °C range. It uses an on-chip band gap temperature sensor and A-to-D conversion technique with an overtemperature detection. The device contains a number of configuration and data registers to store the device settings, such as device operation mode, and a temperature register (Temp) to store the digital temp reading that can be communicated by a controller via the 2-wire serial I3C (up to 12.5 MHz) and I2C (up to 3.4 MHz) interface.| Part No. | P3T1755 |
|---|---|
| Datasheet | P3T1755 Download |
| Manufacturer |  NXP Semiconductors |
| Description | digital temperature sensor |
| Buy | Stock & Price |
FEATURES AND BENEFITS
● I3C (up to 12.5 MHz) and I2C (up to 3.4 MHz) interface – 32 I2C target addresses – 32 I3C Provisional-ID● Supply range: 1.4 V to 3.6 V
● Programmable overtemperature alerts
● Resolution: 12 bits (0.0625 °C)
● Accuracy: – 1.4 V < VCC < 3.6 V – ±0.5 °C (maximum) from –20 °C to +85 °C – ±1 °C (maximum) from -40 °C to +125 °C
● Low quiescent current: 4.1 μA supply current (typical)
● ESD protection exceeds 2000 V HBM per JS-001-2017 and 1000 V CDM per JS-002-2018
● Package: TSSOP8
● P3T1755DP/Q900 for automotive NXP Semiconductors P3T1755 I3C, I2C-bus interface, 0.5 °C accuracy, digital temperature sensor 3
APPLICATIONS
● IoT● Portable devices
● SSD
● Industrial controllers
● Servers
● PC/Notebook
● Automotive (P3T1755DP/Q900) 4 Ordering information Table 1. Ordering Information Type Number Topside mark P3T1755DP P3T1755DP/Q900[1] P1755 Q1755 Package Name TSSOP8 TSSOP8
DESCRIPTION
plastic thin shrink small outline package; 8 leads; body width 3 mm plastic thin shrink small outline package; 8 leads; body width 3 mm [1] P3T1755DP/Q900 is AEC-Q100 compliant.
