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PCD5013 Datasheet Flex Roaming Decoder Ii

Manufacturer: NXP Semiconductors

Overview: INTEGRATED CIRCUITS DATA SHEET PCD5013 FLEX™ roaming decoder II Product specification Supersedes data of 1999 Mar 15 File under Integrated Circuits, IC17 1999 Apr 12 Philips Semiconductors Product specification FLEX™ roaming decoder II CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 9 10 11 12 13 14 15 15.1 15.2 15.3 16 17 17.1 17.2 17.3 17.4 17.

General Description

QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION General Clocking, reset and start-up Serial Peripheral Interface (SPI) Configuration and synchronisation Receiver control interface Configuration of the FLEX™ CAPCODE Call data packets Message reception LIMITING VALUES HANDLING THERMAL CHARACTERISTICS DC CHARACTERISTICS AC CHARACTERISTICS OSCILLATOR CHARACTERISTICS TEST AND APPLICATION INFORMATION FLEX™ protocol Example applications System block diagram PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DEFINITIONS LIFE SUPPORT APPLICATIONS PCD5013 1999 Apr 12 2 Philips Semiconductors Product specification FLEX™ roaming decoder II 1

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