SOT416 Description
Philips Semiconductors Package outline Plastic surface mounted package; PDF 4 November 2004 1.
SOT416 is Package outline manufactured by NXP Semiconductors.
| Part Number | Description |
|---|---|
| SOT414-1 | plastic low profile quad flat package |
| SOT407-1 | plastic low profile quad flat package |
| SOT457 | surface-mounted package |
| SOT1061 | plastic thermal enhanced ultra thin small outline package |
| SOT109-1 | Package outline |
Philips Semiconductors Package outline Plastic surface mounted package; PDF 4 November 2004 1.