MOC8106M Overview
Key Specifications
Package: DIP
Mount Type: Through Hole
Pins: 6
Max Operating Temp: 100 °C
Description
The CNY17XM, CNY17FXM, and MOC8106M devices consist of a gallium arsenide infrared emitting diode coupled with an NPN phototransistor in a dual in-line package.
Key Features
- High BVCEO: 70 V Minimum (CNY17XM, CNY17FXM, MOC8106M)
- Closely Matched Current Transfer Ratio (CTR) Minimizes Unit-to-Unit Variation
- Current Transfer Ratio In Select Groups
- Very Low Coupled Capacitance Along With No Chip-to-Pin 6 Base Connection for Minimum Noise Susceptibility (CNY17FXM, MOC8106M)
- Safety and Regulatory Approvals: UL1577, 4,170 VACRMS for 1 Minute DIN-EN/IEC60747-5-5, 850 V Peak Working Insulation Voltage
