NTTFSS002N04HL Overview
Key Features
- Advanced Source-Down Package Technology (3.3x3.3mm) with Excellent Thermal Conduction
- Ultra Low RDS(on) to Improve System Efficiency
- Low QG and Capacitance to Minimize Driving and Switching Losses
- These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
