MMBD6050 Datasheet | PanJit Semiconductor

FEATURES - Very fast reverse recovery ( trr < 2.0 ns typical ) - Low capacitance ( < 2.5p F @ 0V ) - Surface mount package ideally suited for automatic insertion. - Pb free product are available : 99% Sn above can meet Ro HS environment substance directive request .056(1.40) .047(1.20) .119(3.00) .110(2.80) MECHANICAL DATA Case: SOT-23 plastic Terminals : Solderable per MIL-STD-750,Method 2026 Approx weight : 0.008 gram Marking : T2 .083(2.10) .066(1.70) .006(.15)MAX .020(.50) .013(.35) .044(1.10) .035(0.90) .007(.20)MIN .103(2.60) .086(2.20) Unit: inch (mm) .006(.15) .002(.05) ABSOLUTE RATINGS PARAMETER Maximum Reverse Voltage Peak Reverse Voltage Continuous Forward Current Non-repetitive Peak Forward Surge Current at t=1.0 µs SYMBOL VR VRRM IF IFSM THERMAL CHARACTERISTICS PARAMETER Power Dissipation (1) Thermal Resistance, Junction to Ambient (1) Junction...