ISP1040B
ISP1040B is SCSI I/O Processor manufactured by Qlogic.
Construction Analysis
Qlogic ISP1040B SCSI I/O Processor
Report Number: SCA 9710-557 n Servi g the G lo b a e l S miconductor
In d us try
17350 N. Hartford Drive Scottsdale, AZ 85255 Phone: 602-515-9780 Fax: 602-515-9781 e-mail: ice@ice-corp. Internet: http://.ice-corp.
Since 1964
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INDEX TO TEXT TITLE
INTRODUCTION MAJOR FINDINGS TECHNOLOGY DESCRIPTION Assembly Die Process and Design ANALYSIS RESULTS I Assembly ANALYSIS RESULTS II Die Process and Design ANALYSIS PROCEDURE
PAGE
1 1
2 2-3
5-7 8
TABLES Overall Evaluation Package Markings Wirebond Strength Die and Package Materials Horizontal Dimensions Vertical Dimensions
9 10 10 11 12 13
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INTRODUCTION This report describes a construction analysis of the QLogic ISP1040B SCSI I/O Processor. Six devices were supplied for the analysis which were packaged in 208-pin Plastic Quad Flat Packs (PQFPs) and date coded 9721. MAJOR FINDINGS Questionable Items:1 None. Special Features
:
- Three metal, twin-well CMOS process.
- Sub-micron gate lengths (0.5 micron).
1These items present possible quality or reliability concerns.
They should be discussed with the manufacturer to determine their possible impact on the intended application.
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TECHNOLOGY DESCRIPTION Assembly:
- Devices were packaged in 208-pin Plastic Quad Flat Packs (PQFPs).
- Copper (Cu) gull-wing leadframe tinned with tin-lead (Sn Pb) solder.
- Dimpled paddle for added package strength, paddle was seated on a heat-spreader (Al). Paddle was attached to the heatspreader by a thermal adhesion. Heatspreader was not visible on x-ray (Figure 2).
- Paddle was constructed of copper (Cu) and internally plated with silver (Ag).
- Lead-locking provisions (anchors) at all pins. Lead-locking holes at paddle tie...
