ISP1040B Description
Six devices were supplied for the analysis which were packaged in 208-pin Plastic Quad Flat Packs (PQFPs) and date coded 9721. MAJOR FINDINGS Questionable Items:1 None.
ISP1040B Key Features
- Three metal, twin-well CMOS process
- Sub-micron gate lengths (0.5 micron)
- Devices were packaged in 208-pin Plastic Quad Flat Packs (PQFPs)
- Copper (Cu) gull-wing leadframe tinned with tin-lead (SnPb) solder
- Dimpled paddle for added package strength, paddle was seated on a heat-spreader (Al). Paddle was attached to the heatspr
- Paddle was constructed of copper (Cu) and internally plated with silver (Ag)
- Lead-locking provisions (anchors) at all pins. Lead-locking holes at paddle tie bars
- Thermosonic ball bond method employing 1.1 mil O.D. gold wire
- Sawn dicing (full depth)
- Silver-epoxy die attach. Die Process