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HSC226
Silicon Schottky Barrier Diode for High Speed Switching
REJ03G0599-0300 Rev.3.00 Sep 15, 2006
Features
• Low reverse current, Low capacitance. • Ultra small Flat Lead Package (UFP) is suitable for surface mount design.
Ordering Information
Type No. HSC226 Cathode Mark S4 Package Name UFP Package Code PWSF0002ZA-A
Pin Arrangement
Cathode mark Mark 1
S4
2 1. Cathode 2. Anode
Rev.3.00 Sep 15, 2006 page 1 of 4
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